Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521952 | Spacer for die-to-die communication in an integrated circuit and method for fabricating the same | Charles L. Arvin, Bhupender Singh, Richard F. Indyk, Steve Ostrander, Thomas Weiss | 2022-12-06 |
| 11404365 | Direct attachment of capacitors to flip chip dies | Charles L. Arvin, Bhupender Singh, Brian W. Quinlan, Sylvain Pharand | 2022-08-02 |
| 11393759 | Alignment carrier for interconnect bridge assembly | Thomas Weiss, Charles L. Arvin, Glenn A. Pomerantz, Rachel E. Olson, Bhupender Singh | 2022-07-19 |