Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11228124 | Connecting a component to a substrate by adhesion to an oxidized solder surface | Mark K. Hoffmeyer, Steven P. Ostrander, Thomas Weiss | 2022-01-18 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11228124 | Connecting a component to a substrate by adhesion to an oxidized solder surface | Mark K. Hoffmeyer, Steven P. Ostrander, Thomas Weiss | 2022-01-18 |