Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11500290 | Adhesion promoters | Bharat Kumar, Ekmini Anuja De Silva, Jing Guo | 2022-11-15 |
| 11462512 | Three-dimensional microelectronic package with embedded cooling channels | Kamal K. Sikka, Fee Li Lie, Kevin R. Winstel, Ravi K. Bonam, Iqbal Rashid Saraf +2 more | 2022-10-04 |
| 11367617 | Graded hardmask interlayer for enhanced extreme ultraviolet performance | Jennifer Church, Ekmini Anuja De Silva | 2022-06-21 |
| 11307496 | Metal brush layer for EUV patterning | Ekmini Anuja De Silva, Jing Guo, Jennifer Church | 2022-04-19 |