Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11341831 | Device and system for ultrasonic transmission of accelerometer data | Patrick LaFontaine | 2022-05-24 |
| 11315831 | Dual redistribution layer structure | Mukta G. Farooq | 2022-04-26 |
| 11282716 | Integration structure and planar joining | Mukta G. Farooq | 2022-03-22 |
| 11264306 | Hybrid TIMs for electronic package cooling | Kamal K. Sikka, Piyas Bal Chowdhury, Jeffrey A. Zitz, Sushumna Iruvanti, Shidong Li | 2022-03-01 |
| 11251126 | Replacement metal cap by an exchange reaction | Cornelius Brown Peethala | 2022-02-15 |
| 11239167 | Cu—Cu bonding for interconnects on bridge chip attached to chips and packaging substrate | Mukta G. Farooq, Ravi K. Bonam, Spyridon Skordas | 2022-02-01 |