Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404379 | Structure and method for bridge chip assembly with capillary underfill | Katsuyuki Sakuma | 2022-08-02 |
| 11355379 | Oxide-bonded wafer pair separation using laser debonding | Dale Curtis McHerron, Spyridon Skordas | 2022-06-07 |
| 11315831 | Dual redistribution layer structure | James J. Kelly | 2022-04-26 |
| 11282716 | Integration structure and planar joining | James J. Kelly | 2022-03-22 |
| 11239167 | Cu—Cu bonding for interconnects on bridge chip attached to chips and packaging substrate | Ravi K. Bonam, James J. Kelly, Spyridon Skordas | 2022-02-01 |