| 11488863 |
Self-aligned contact scheme for pillar-based memory elements |
Benjamin D. Briggs, Michael Rizzolo |
2022-11-01 |
| 11444029 |
Back-end-of-line interconnect structures with varying aspect ratios |
Prasad Bhosale, Michael Rizzolo, Chih-Chao Yang |
2022-09-13 |
| 11437317 |
Single-mask alternating line deposition |
Brent A. Anderson, Lawrence A. Clevenger, Christopher J. Penny, Kisik Choi, Robert R. Robison |
2022-09-06 |
| 11430735 |
Barrier removal for conductor in top via integration scheme |
Brent A. Anderson, Christopher J. Penny, Lawrence A. Clevenger, Kisik Choi, Robert R. Robison |
2022-08-30 |
| 11348872 |
Hybrid dielectric scheme for varying liner thickness and manganese concentration |
Benjamin D. Briggs, Lawrence A. Clevenger, Takeshi Nogami, Christopher J. Penny, Michael Rizzolo |
2022-05-31 |
| 11315827 |
Skip via connection between metallization levels |
Huai Huang, Lawrence A. Clevenger, Hosadurga Shobha, Christopher J. Penny |
2022-04-26 |
| 11302575 |
Subtractive line with damascene second line type |
Brent A. Anderson, Christopher J. Penny, Lawrence A. Clevenger, Kisik Choi, Robert R. Robison |
2022-04-12 |
| 11295978 |
Interconnects having spacers for improved top via critical dimension and overlay tolerance |
Brent A. Anderson, Lawrence A. Clevenger, Christopher J. Penny, Kisik Choi, Robert R. Robison |
2022-04-05 |
| 11289371 |
Top vias with selectively retained etch stops |
Brent A. Anderson, Lawrence A. Clevenger, Christopher J. Penny, Kisik Choi, Robert R. Robison |
2022-03-29 |
| 11276639 |
Conductive lines with subtractive cuts |
Brent A. Anderson, Lawrence A. Clevenger, Kisik Choi, Christopher J. Penny, Robert R. Robison |
2022-03-15 |
| 11276611 |
Top via on subtractively etched conductive line |
Brent A. Anderson, Lawrence A. Clevenger, Kisik Choi, Christopher J. Penny, Robert R. Robison |
2022-03-15 |
| 11244859 |
Interconnects having a via-to-line spacer for preventing short circuit events between a conductive via and an adjacent line |
Koichi Motoyama, Cornelius Brown Peethala, Christopher J. Penny, Lawrence A. Clevenger |
2022-02-08 |
| 11232977 |
Stepped top via for via resistance reduction |
Brent A. Anderson, Lawrence A. Clevenger, Christopher J. Penny, Kisik Choi, Robert R. Robison |
2022-01-25 |
| 11223655 |
Semiconductor tool matching and manufacturing management in a blockchain |
Prasad Bhosale, Michael Rizzolo, Chih-Chao Yang |
2022-01-11 |
| 11217481 |
Fully aligned top vias |
Koichi Motoyama, Somnath Ghosh, Christopher J. Penny, Robert R. Robison, Lawrence A. Clevenger |
2022-01-04 |
