Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11315827 | Skip via connection between metallization levels | Huai Huang, Lawrence A. Clevenger, Christopher J. Penny, Nicholas Anthony Lanzillo | 2022-04-26 |
| 11232983 | Copper interconnect structure with manganese barrier layer | Daniel C. Edelstein, Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini | 2022-01-25 |