Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11232983 | Copper interconnect structure with manganese barrier layer | Daniel C. Edelstein, Son V. Nguyen, Takeshi Nogami, Hosadurga Shobha | 2022-01-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11232983 | Copper interconnect structure with manganese barrier layer | Daniel C. Edelstein, Son V. Nguyen, Takeshi Nogami, Hosadurga Shobha | 2022-01-25 |