Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11315827 | Skip via connection between metallization levels | Lawrence A. Clevenger, Hosadurga Shobha, Christopher J. Penny, Nicholas Anthony Lanzillo | 2022-04-26 |
| 11244861 | Method and structure for forming fully-aligned via | Ruilong Xie, Christopher J. Waskiewicz, Chih-Chao Yang | 2022-02-08 |