Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430690 | Interconnects having air gap spacers | Kenneth Chun Kuen Cheng, Koichi Motoyama, Oscar van der Straten, Chih-Chao Yang | 2022-08-30 |
| 11380641 | Pillar bump with noble metal seed layer for advanced heterogeneous integration | Kenneth Chun Kuen Cheng, Koichi Motoyama, Oscar van der Straten, Alexander Reznicek | 2022-07-05 |
| 11282768 | Fully-aligned top-via structures with top-via trim | Kenneth Chun Kuen Cheng, Koichi Motoyama, Brent A. Anderson | 2022-03-22 |