Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430690 | Interconnects having air gap spacers | Kenneth Chun Kuen Cheng, Koichi Motoyama, Joseph F. Maniscalco, Chih-Chao Yang | 2022-08-30 |
| 11380641 | Pillar bump with noble metal seed layer for advanced heterogeneous integration | Joseph F. Maniscalco, Kenneth Chun Kuen Cheng, Koichi Motoyama, Alexander Reznicek | 2022-07-05 |
| 11322359 | Single process for liner and metal fill | Praneet Adusumilli, Alexander Reznicek, Chih-Chao Yang | 2022-05-03 |
| 11270910 | Interconnect structure with partial sidewall liner | Alexander Reznicek | 2022-03-08 |
| 11239414 | Physical unclonable function for MRAM structures | Ruilong Xie, Alexander Reznicek, Koichi Motoyama | 2022-02-01 |