Issued Patents 2022
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430690 | Interconnects having air gap spacers | Koichi Motoyama, Oscar van der Straten, Joseph F. Maniscalco, Chih-Chao Yang | 2022-08-30 |
| 11410879 | Subtractive back-end-of-line vias | Chanro Park, Koichi Motoyama, Chih-Chao Yang | 2022-08-09 |
| 11380641 | Pillar bump with noble metal seed layer for advanced heterogeneous integration | Joseph F. Maniscalco, Koichi Motoyama, Oscar van der Straten, Alexander Reznicek | 2022-07-05 |
| 11315872 | Self-aligned top via | Chanro Park, Koichi Motoyama, Kisik Choi, Chih-Chao Yang | 2022-04-26 |
| 11289375 | Fully aligned interconnects with selective area deposition | Chanro Park, Koichi Motoyama, Chih-Chao Yang | 2022-03-29 |
| 11282768 | Fully-aligned top-via structures with top-via trim | Koichi Motoyama, Brent A. Anderson, Joseph F. Maniscalco | 2022-03-22 |
| 11270913 | BEOL metallization formation | Chanro Park, Koichi Motoyama, Brent A. Anderson, Somnath Ghosh | 2022-03-08 |
| 11244853 | Fully aligned via interconnects with partially removed etch stop layer | Koichi Motoyama, Chanro Park, Chih-Chao Yang | 2022-02-08 |
| 11244897 | Back end of line metallization | Chanro Park, Koichi Motoyama, Somnath Ghosh, Chih-Chao Yang | 2022-02-08 |
| 11244854 | Dual damascene fully aligned via in interconnects | Koichi Motoyama, Chanro Park, Chih-Chao Yang | 2022-02-08 |