Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11264276 | Interconnect integration scheme with fully self-aligned vias | Terry A. Spooner | 2022-03-01 |
| 11244860 | Double patterning interconnect integration scheme with SAV | Terry A. Spooner, Koichi Motoyama, Chih-Chao Yang | 2022-02-08 |
| 11239421 | Embedded BEOL memory device with top electrode pillar | Dexin Kong, Soon-Cheon Seo, Youngseok Kim, Theodorus E. Standaert | 2022-02-01 |
| 11227792 | Interconnect structures including self aligned vias | Chih-Chao Yang, Terry A. Spooner, Koichi Motoyama | 2022-01-18 |