| 11508898 |
Piezoelectric devices fabricated in packaging build-up layers |
Shawna M. Liff |
2022-11-22 |
$12,862,000 |
| 11482472 |
Thermal management solutions for stacked integrated circuit devices |
Adel A. Elsherbini, Johanna M. Swan |
2022-10-25 |
$11,792,000 |
| 11469206 |
Microelectronic assemblies |
Adel A. Elsherbini, Johanna M. Swan, Shawna M. Lift |
2022-10-11 |
$16,542,000 |
| 11456721 |
RF front end module including hybrid filter and active circuits in a single package |
Telesphor Kamgaing, Georgios Dogiamis, Vijay K. Nair, Johanna M. Swan |
2022-09-27 |
$23,391,000 |
| 11424239 |
Diodes for package substrate electrostatic discharge (ESD) protection |
Aleksandar Aleksov, Adel A. Elsherbini, Veronica Strong, Johanna M. Swan |
2022-08-23 |
$15,804,000 |
| 11421376 |
Inorganic piezoelectric materials formed on fibers and applications thereof |
Shawna M. Liff, Aleksandar Aleksov, Sasha N. Oster, Baris Bicen, Thomas L. Sounart +2 more |
2022-08-23 |
$15,804,000 |
| 11417586 |
Thermal management solutions for substrates in integrated circuit packages |
Adel A. Elsherbini, Johanna M. Swan |
2022-08-16 |
$17,788,000 |
| 11387161 |
Package with thermal interface material retaining structures on die and heat spreader |
— |
2022-07-12 |
$13,106,000 |
| 11380624 |
Electromagnetic interference shield created on package using high throughput additive manufacturing |
Henning Braunisch, Shawna M. Liff, Georgios Dogiamis, Johanna M. Swan |
2022-07-05 |
$18,093,000 |
| 11348882 |
Package spark gap structure |
Aleksandar Aleksov, Johanna M. Swan, Adel A. Elsherbini, Veronica Strong |
2022-05-31 |
$16,893,000 |
| 11342243 |
Thermal management solutions for embedded integrated circuit devices |
Adel A. Elsherbini, Johanna M. Swan |
2022-05-24 |
$18,289,000 |
| 11328979 |
Substrate integrated posts and heat spreader customization for enhanced package thermomechanics |
Dinesh Padmanabhan Ramalekshmi Thanu, Sergio Antonio Chan Arguedas, Johanna M. Swan, John J. Beatty |
2022-05-10 |
$19,182,000 |
| 11329358 |
Low loss and low cross talk transmission lines having l-shaped cross sections |
Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen +3 more |
2022-05-10 |
$19,182,000 |
| 11328986 |
Capacitor-wirebond pad structures for integrated circuit packages |
Aleksandar Aleksov, Georgios Dogiamis, Telesphor Kamgaing, Johanna M. Swan |
2022-05-10 |
$19,182,000 |
| 11328978 |
Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense |
Johanna M. Swan, Sergio Antonio Chan Arguedas, John J. Beatty |
2022-05-10 |
$19,182,000 |
| 11322456 |
Die back side structures for warpage control |
Venkata Suresh R. Guthikonda, Shankar Devasenathipathy, Chandra Mohan Jha, Je-Young Chang, Kyle Yazzie +2 more |
2022-05-03 |
$16,346,000 |
| 11316497 |
Multi-filter die |
Georgios Dogiamis, Aleksandar Aleksov, Telesphor Kamgaing, Johanna M. Swan |
2022-04-26 |
$25,630,000 |
| 11310907 |
Microelectronic package with substrate-integrated components |
Georgios Dogiamis, Aleksandar Aleksov, Telesphor Kamgaing, Johanna M. Swan |
2022-04-19 |
$22,207,000 |
| 11302599 |
Heat dissipation device having a thermally conductive structure and a thermal isolation structure in the thermally conductive structure |
Adel A. Elsherbini, Johanna M. Swan |
2022-04-12 |
$16,909,000 |
| 11302618 |
Microelectronic assemblies having substrate-integrated perovskite layers |
Shawna M. Liff, Thomas L. Sounart, Johanna M. Swan |
2022-04-12 |
$16,909,000 |
| 11296040 |
Electrostatic discharge protection in integrated circuits |
Adel A. Elsherbini, Johanna M. Swan, Aleksandar Aleksov, Veronica Strong |
2022-04-05 |
$18,322,000 |
| 11289431 |
Electrostatic discharge protection in integrated circuits using materials with optically controlled electrical conductivity |
Veronica Strong, Aleksandar Aleksov, Adel A. Elsherbini, Johanna M. Swan |
2022-03-29 |
$28,068,000 |
| 11282800 |
Substrate integrated inductors using high throughput additive deposition of hybrid magnetic materials |
Henning Braunisch, Georgios Dogiamis |
2022-03-22 |
$16,833,000 |
| 11283427 |
Hybrid filters and packages therefor |
Telesphor Kamgaing, Georgios Dogiamis, Vijay K. Nair, Johanna M. Swan |
2022-03-22 |
$16,833,000 |
| 11282812 |
Thermal management solutions for stacked integrated circuit devices using jumping drops vapor chambers |
Adel A. Elsherbini, Johanna M. Swan |
2022-03-22 |
$16,833,000 |
