Issued Patents 2022
Showing 25 most recent of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508898 | Piezoelectric devices fabricated in packaging build-up layers | Shawna M. Liff | 2022-11-22 |
| 11482472 | Thermal management solutions for stacked integrated circuit devices | Adel A. Elsherbini, Johanna M. Swan | 2022-10-25 |
| 11469206 | Microelectronic assemblies | Adel A. Elsherbini, Johanna M. Swan, Shawna M. Lift | 2022-10-11 |
| 11456721 | RF front end module including hybrid filter and active circuits in a single package | Telesphor Kamgaing, Georgios Dogiamis, Vijay K. Nair, Johanna M. Swan | 2022-09-27 |
| 11424239 | Diodes for package substrate electrostatic discharge (ESD) protection | Aleksandar Aleksov, Adel A. Elsherbini, Veronica Strong, Johanna M. Swan | 2022-08-23 |
| 11421376 | Inorganic piezoelectric materials formed on fibers and applications thereof | Shawna M. Liff, Aleksandar Aleksov, Sasha N. Oster, Baris Bicen, Thomas L. Sounart +2 more | 2022-08-23 |
| 11417586 | Thermal management solutions for substrates in integrated circuit packages | Adel A. Elsherbini, Johanna M. Swan | 2022-08-16 |
| 11387161 | Package with thermal interface material retaining structures on die and heat spreader | — | 2022-07-12 |
| 11380624 | Electromagnetic interference shield created on package using high throughput additive manufacturing | Henning Braunisch, Shawna M. Liff, Georgios Dogiamis, Johanna M. Swan | 2022-07-05 |
| 11348882 | Package spark gap structure | Aleksandar Aleksov, Johanna M. Swan, Adel A. Elsherbini, Veronica Strong | 2022-05-31 |
| 11342243 | Thermal management solutions for embedded integrated circuit devices | Adel A. Elsherbini, Johanna M. Swan | 2022-05-24 |
| 11328979 | Substrate integrated posts and heat spreader customization for enhanced package thermomechanics | Dinesh Padmanabhan Ramalekshmi Thanu, Sergio Antonio Chan Arguedas, Johanna M. Swan, John J. Beatty | 2022-05-10 |
| 11329358 | Low loss and low cross talk transmission lines having l-shaped cross sections | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen +3 more | 2022-05-10 |
| 11328986 | Capacitor-wirebond pad structures for integrated circuit packages | Aleksandar Aleksov, Georgios Dogiamis, Telesphor Kamgaing, Johanna M. Swan | 2022-05-10 |
| 11328978 | Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense | Johanna M. Swan, Sergio Antonio Chan Arguedas, John J. Beatty | 2022-05-10 |
| 11322456 | Die back side structures for warpage control | Venkata Suresh R. Guthikonda, Shankar Devasenathipathy, Chandra Mohan Jha, Je-Young Chang, Kyle Yazzie +2 more | 2022-05-03 |
| 11316497 | Multi-filter die | Georgios Dogiamis, Aleksandar Aleksov, Telesphor Kamgaing, Johanna M. Swan | 2022-04-26 |
| 11310907 | Microelectronic package with substrate-integrated components | Georgios Dogiamis, Aleksandar Aleksov, Telesphor Kamgaing, Johanna M. Swan | 2022-04-19 |
| 11302599 | Heat dissipation device having a thermally conductive structure and a thermal isolation structure in the thermally conductive structure | Adel A. Elsherbini, Johanna M. Swan | 2022-04-12 |
| 11302618 | Microelectronic assemblies having substrate-integrated perovskite layers | Shawna M. Liff, Thomas L. Sounart, Johanna M. Swan | 2022-04-12 |
| 11296040 | Electrostatic discharge protection in integrated circuits | Adel A. Elsherbini, Johanna M. Swan, Aleksandar Aleksov, Veronica Strong | 2022-04-05 |
| 11289431 | Electrostatic discharge protection in integrated circuits using materials with optically controlled electrical conductivity | Veronica Strong, Aleksandar Aleksov, Adel A. Elsherbini, Johanna M. Swan | 2022-03-29 |
| 11282800 | Substrate integrated inductors using high throughput additive deposition of hybrid magnetic materials | Henning Braunisch, Georgios Dogiamis | 2022-03-22 |
| 11283427 | Hybrid filters and packages therefor | Telesphor Kamgaing, Georgios Dogiamis, Vijay K. Nair, Johanna M. Swan | 2022-03-22 |
| 11282812 | Thermal management solutions for stacked integrated circuit devices using jumping drops vapor chambers | Adel A. Elsherbini, Johanna M. Swan | 2022-03-22 |