Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495552 | Substrate integrated thin film capacitors using amorphous high-k dielectrics | Aleksandar Aleksov, Kristof Darmawikarta, Henning Braunisch, Prithwish Chatterjee, Andrew J. Brown | 2022-11-08 |
| 11421376 | Inorganic piezoelectric materials formed on fibers and applications thereof | Shawna M. Liff, Feras Eid, Aleksandar Aleksov, Sasha N. Oster, Baris Bicen +2 more | 2022-08-23 |
| 11302618 | Microelectronic assemblies having substrate-integrated perovskite layers | Feras Eid, Shawna M. Liff, Johanna M. Swan | 2022-04-12 |
| 11223524 | Package integrated security features | Shawna M. Liff, Adel A. Elsherbini, Sasha N. Oster, Feras Eid, Georgios Dogiamis +1 more | 2022-01-11 |