Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508645 | Modular technique for die-level liquid cooling | Chandra Mohan Jha | 2022-11-22 |
| 11495518 | Multi-surface heat sink suitable for multi-chip packages | Shrenik Kothari, Sandeep Ahuja, Susan F. Smith, Jeffory L. Smalley, Francisco Gabriel Lozano Sanchez +5 more | 2022-11-08 |
| 11469185 | Standoff members for semiconductor package | Shubhada H. Sahasrabudhe, Tannaz Harirchian | 2022-10-11 |
| 11456232 | Thermal assemblies for multi-chip packages | Zhimin Wan, Chia-Pin Chiu, Shankar Devasenathipathy, Betsegaw K. Gebrehiwot, Chandra Mohan Jha | 2022-09-27 |
| 11378346 | Two-phase metallic alloys to facilitate thermal energy storage of a system on chip | — | 2022-07-05 |
| 11322456 | Die back side structures for warpage control | Feras Eid, Venkata Suresh R. Guthikonda, Shankar Devasenathipathy, Chandra Mohan Jha, Kyle Yazzie +2 more | 2022-05-03 |