Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495518 | Multi-surface heat sink suitable for multi-chip packages | Sandeep Ahuja, Susan F. Smith, Jeffory L. Smalley, Francisco Gabriel Lozano Sanchez, Maria de la Luz Belmont Velazquez +5 more | 2022-11-08 |
| 11398414 | Sloped metal features for cooling hotspots in stacked-die packages | Zhimin Wan, Chia-Pin Chiu, Pooya Tadayon, Joe Walczyk, Chandra Mohan Jha +2 more | 2022-07-26 |