Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515232 | Liquid cooling through conductive interconnect | Chia-Pin Chiu, Robert L. Sankman | 2022-11-29 |
| 11398414 | Sloped metal features for cooling hotspots in stacked-die packages | Zhimin Wan, Chia-Pin Chiu, Joe Walczyk, Chandra Mohan Jha, Weihua Tang +2 more | 2022-07-26 |
| 11372023 | Slip-plane MEMs probe for high-density and fine pitch interconnects | Joe Walczyk | 2022-06-28 |
| 11268983 | Chevron interconnect for very fine pitch probing | — | 2022-03-08 |
| 11262384 | Fine pitch probe card methods and systems | David Shia | 2022-03-01 |
| 11249113 | High density and fine pitch interconnect structures in an electric test apparatus | Mark Bohr, Joe Walczyk | 2022-02-15 |