Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11444003 | Integrated heat spreader with multiple channels for multichip packages | Zhimin Wan, Chia-Pin Chiu, Chandra Mohan Jha, Shankar Devasenathipathy | 2022-09-13 |
| 11398414 | Sloped metal features for cooling hotspots in stacked-die packages | Zhimin Wan, Chia-Pin Chiu, Pooya Tadayon, Joe Walczyk, Chandra Mohan Jha +2 more | 2022-07-26 |
| 11374605 | Self-diagnosis system for wireless transceivers with multiple antennas | — | 2022-06-28 |