Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11469185 | Standoff members for semiconductor package | Je-Young Chang, Tannaz Harirchian | 2022-10-11 |
| 11276625 | Methods of forming flexure based cooling solutions for package structures | Siddarth Kumar, Sandeep B. Sane, Shalabh Tandon | 2022-03-15 |