Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11417592 | Methods of utilizing low temperature solder assisted mounting techniques for package structures | Omkar G. Karhade, Nachiket R. Raravikar | 2022-08-16 |
| 11276625 | Methods of forming flexure based cooling solutions for package structures | Siddarth Kumar, Shubhada H. Sahasrabudhe, Shalabh Tandon | 2022-03-15 |