Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11417592 | Methods of utilizing low temperature solder assisted mounting techniques for package structures | Omkar G. Karhade, Sandeep B. Sane | 2022-08-16 |
| 11404349 | Multi-chip packages and sinterable paste for use with thermal interface materials | Ravindranath V. Mahajan, Robert L. Sankman, James C. Matayabas, Jr., Ken Hackenberg, Nayandeep K. Mahanta +1 more | 2022-08-02 |