Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404349 | Multi-chip packages and sinterable paste for use with thermal interface materials | Nachiket R. Raravikar, Ravindranath V. Mahajan, Robert L. Sankman, James C. Matayabas, Jr., Ken Hackenberg +1 more | 2022-08-02 |