Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11417630 | Semiconductor package having passive support wafer | Debendra Mallik, Digvijay A. Raorane, Mitul Modi | 2022-08-16 |
| 11404349 | Multi-chip packages and sinterable paste for use with thermal interface materials | Nachiket R. Raravikar, Robert L. Sankman, James C. Matayabas, Jr., Ken Hackenberg, Nayandeep K. Mahanta +1 more | 2022-08-02 |
| 11328968 | Stacked die cavity package | Mitul Modi, Robert L. Sankman, Debendra Mallik, Amruthavalli Pallavi Alur, Yikang Deng +1 more | 2022-05-10 |
| 11257804 | Distributed semiconductor die and package architecture | Wilfred Gomes, Mark Bohr, Rajesh Kumar, Robert L. Sankman, Wesley D. Mc Cullough | 2022-02-22 |
| 11222847 | Enabling long interconnect bridges | Zhiguo Qian, Henning Braunisch, Kemal Aygun, Sujit Sharan | 2022-01-11 |
| 11217573 | Dual-sided co-packaged optics for high bandwidth networking applications | Suresh Pothukuchi, Andrew C. Alduino, Srikant Nekkanty, Ling Liao, Harinadh POTLURI +5 more | 2022-01-04 |