Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11387198 | Device, system and method for providing inductor structures | Mark Bohr, Doug B. Ingerly, Rajesh Kumar, Harish Krishnamurthy, Nachiket Desai | 2022-07-12 |
| 11373987 | Device, method and system for providing a stacked arrangement of integrated circuit dies | Mark Bohr, Glenn J. Hinton, Rajesh Kumar | 2022-06-28 |
| 11335686 | Transistors with back-side contacts to create three dimensional memory and logic | Mauro J. Kobrinsky, Abhishek A. Sharma, Tahir Ghani, Doug B. Ingerly, Rajesh Kumar | 2022-05-17 |
| 11257804 | Distributed semiconductor die and package architecture | Mark Bohr, Rajesh Kumar, Robert L. Sankman, Ravindranath V. Mahajan, Wesley D. Mc Cullough | 2022-02-22 |
| 11257822 | Three-dimensional nanoribbon-based dynamic random-access memory | Kinyip Phoa, Mauro J. Kobrinsky, Tahir Ghani, Uygar E. Avci, Rajesh Kumar | 2022-02-22 |
| 11239238 | Thin film transistor based memory cells on both sides of a layer of logic devices | Mauro J. Kobrinsky, Conor P. Puls, Kevin J. Fischer, Bernhard Sell, Abhishek A. Sharma +1 more | 2022-02-01 |