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Device, system and method for providing inductor structures |
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Device, method and system for providing a stacked arrangement of integrated circuit dies |
Mark Bohr, Glenn J. Hinton, Rajesh Kumar |
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Transistors with back-side contacts to create three dimensional memory and logic |
Mauro J. Kobrinsky, Abhishek A. Sharma, Tahir Ghani, Doug B. Ingerly, Rajesh Kumar |
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Distributed semiconductor die and package architecture |
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Three-dimensional nanoribbon-based dynamic random-access memory |
Kinyip Phoa, Mauro J. Kobrinsky, Tahir Ghani, Uygar E. Avci, Rajesh Kumar |
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Thin film transistor based memory cells on both sides of a layer of logic devices |
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2022-02-01 |