Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11257804 | Distributed semiconductor die and package architecture | Wilfred Gomes, Mark Bohr, Rajesh Kumar, Robert L. Sankman, Ravindranath V. Mahajan | 2022-02-22 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11257804 | Distributed semiconductor die and package architecture | Wilfred Gomes, Mark Bohr, Rajesh Kumar, Robert L. Sankman, Ravindranath V. Mahajan | 2022-02-22 |