Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508636 | Multi-layer solution based deposition of dielectrics for advanced substrate architectures | Andrew J. Brown, Ji-Yong Park, Siddharth K. Alur, Cheng Xu | 2022-11-22 |
| 11430724 | Ultra-thin, hyper-density semiconductor packages | Debendra Mallik, Robert L. Sankman, Robert M. Nickerson, Mitul Modi, Sanka Ganesan +4 more | 2022-08-30 |
| 11430740 | Microelectronic device with embedded die substrate on interposer | Robert Alan May, Islam A. Salama, Sri Ranga Sai Boyapati, Sheng Li, Kristof Darmawikarta +1 more | 2022-08-30 |
| 11404364 | Multi-layer embedded magnetic inductor coil | Huong Do, Kaladhar Radhakrishnan, Krishna Bharath, Yikang Deng | 2022-08-02 |
| 11393751 | Package-integrated multi-turn coil embedded in a package magnetic core | Huong Do, Kaladhar Radhakrishnan, Krishna Bharath, Yikang Deng | 2022-07-19 |
| 11328968 | Stacked die cavity package | Mitul Modi, Robert L. Sankman, Debendra Mallik, Ravindranath V. Mahajan, Yikang Deng +1 more | 2022-05-10 |
| 11272619 | Apparatus with embedded fine line space in a cavity, and a method for forming the same | Kristof Darmawikarta, Robert Alan May, Yikang Deng, Ji-Yong Park, Maroun D. Moussallem +2 more | 2022-03-08 |