Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462527 | Micro-trenching mold interface in a pop package | Kumar Abhishek Singh, Zhaozhi Li, Thomas J. Debonis, Rees WINTERS | 2022-10-04 |
| 11430724 | Ultra-thin, hyper-density semiconductor packages | Debendra Mallik, Robert L. Sankman, Mitul Modi, Sanka Ganesan, Rajasekaran Swaminathan +4 more | 2022-08-30 |
| 11222877 | Thermally coupled package-on-package semiconductor packages | Omkar G. Karhade, Robert L. Sankman, Nitin A. Deshpande, Mitul Modi, Thomas J. De Bonis +6 more | 2022-01-11 |