Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11348911 | Multi-chip packaging | Robert L. Sankman, Sairam Agraharam, Shengquan Ou, Todd Spencer, Yang Sun +1 more | 2022-05-31 |
| 11222877 | Thermally coupled package-on-package semiconductor packages | Omkar G. Karhade, Robert L. Sankman, Nitin A. Deshpande, Mitul Modi, Robert M. Nickerson +6 more | 2022-01-11 |