Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430724 | Ultra-thin, hyper-density semiconductor packages | Debendra Mallik, Robert L. Sankman, Robert M. Nickerson, Sanka Ganesan, Rajasekaran Swaminathan +4 more | 2022-08-30 |
| 11417630 | Semiconductor package having passive support wafer | Debendra Mallik, Digvijay A. Raorane, Ravindranath V. Mahajan | 2022-08-16 |
| 11328968 | Stacked die cavity package | Robert L. Sankman, Debendra Mallik, Ravindranath V. Mahajan, Amruthavalli Pallavi Alur, Yikang Deng +1 more | 2022-05-10 |
| 11222877 | Thermally coupled package-on-package semiconductor packages | Omkar G. Karhade, Robert L. Sankman, Nitin A. Deshpande, Thomas J. De Bonis, Robert M. Nickerson +6 more | 2022-01-11 |