Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521931 | Microelectronic structures including bridges | Jason M. Gamba, Mohit Bhatia, Omkar G. Karhade, Bai Nie, Gang Duan +2 more | 2022-12-06 |
| 11522291 | Antenna boards and communication devices | Omkar G. Karhade, William J. Lambert, Xiaoqian Li, Debendra Mallik | 2022-12-06 |
| 11373972 | Microelectronic structures including bridges | Omkar G. Karhade, Mohit Bhatia, Anurag Tripathi, Takeshi Nakazawa, Steve Cho | 2022-06-28 |
| 11328937 | Low cost package warpage solution | Omkar G. Karhade, Debendra Mallik, Bassam M. Ziadeh, Yoshihiro Tomita | 2022-05-10 |
| 11254563 | Mold material architecture for package device structures | Omkar G. Karhade | 2022-02-22 |
| 11222877 | Thermally coupled package-on-package semiconductor packages | Omkar G. Karhade, Robert L. Sankman, Mitul Modi, Thomas J. De Bonis, Robert M. Nickerson +6 more | 2022-01-11 |