Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11387200 | Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric | Georgios Dogiamis, Telesphor Kamgaing, Javier A. Falcon, Vijay K. Nair | 2022-07-12 |
| 11335651 | Microelectronic devices designed with compound semiconductor devices and integrated on an inter die fabric | Telesphor Kamgaing, Georgios Dogiamis, Vijay K. Nair, Javier A. Falcon, Shawna M. Liff | 2022-05-17 |
| 11328937 | Low cost package warpage solution | Omkar G. Karhade, Nitin A. Deshpande, Debendra Mallik, Bassam M. Ziadeh | 2022-05-10 |
| 11272612 | Flexible substrate | — | 2022-03-08 |