| 11522291 |
Antenna boards and communication devices |
William J. Lambert, Xiaoqian Li, Nitin A. Deshpande, Debendra Mallik |
2022-12-06 |
| 11521931 |
Microelectronic structures including bridges |
Jason M. Gamba, Nitin A. Deshpande, Mohit Bhatia, Bai Nie, Gang Duan +2 more |
2022-12-06 |
| 11430724 |
Ultra-thin, hyper-density semiconductor packages |
Debendra Mallik, Robert L. Sankman, Robert M. Nickerson, Mitul Modi, Sanka Ganesan +4 more |
2022-08-30 |
| 11417592 |
Methods of utilizing low temperature solder assisted mounting techniques for package structures |
Nachiket R. Raravikar, Sandeep B. Sane |
2022-08-16 |
| 11373972 |
Microelectronic structures including bridges |
Nitin A. Deshpande, Mohit Bhatia, Anurag Tripathi, Takeshi Nakazawa, Steve Cho |
2022-06-28 |
| 11328937 |
Low cost package warpage solution |
Nitin A. Deshpande, Debendra Mallik, Bassam M. Ziadeh, Yoshihiro Tomita |
2022-05-10 |
| 11254563 |
Mold material architecture for package device structures |
Nitin A. Deshpande |
2022-02-22 |
| 11222877 |
Thermally coupled package-on-package semiconductor packages |
Robert L. Sankman, Nitin A. Deshpande, Mitul Modi, Thomas J. De Bonis, Robert M. Nickerson +6 more |
2022-01-11 |