Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430724 | Ultra-thin, hyper-density semiconductor packages | Debendra Mallik, Robert L. Sankman, Robert M. Nickerson, Mitul Modi, Rajasekaran Swaminathan +4 more | 2022-08-30 |
| 11410919 | Stacked silicon die architecture with mixed flipcip and wirebond interconnect | Robert L. Sankman | 2022-08-09 |
| 11387175 | Interposer package-on-package (PoP) with solder array thermal contacts | Debendra Mallik, Pilin Liu, Shawna M. Liff, Sri Chaitra Jyotsna Chavali, Sandeep Gaan +2 more | 2022-07-12 |
| 11302643 | Microelectronic component having molded regions with through-mold vias | Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba, Manish Dubey +1 more | 2022-04-12 |
| 11276630 | Planar integrated circuit package interconnects | Robert L. Sankman | 2022-03-15 |