Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430724 | Ultra-thin, hyper-density semiconductor packages | Debendra Mallik, Robert L. Sankman, Robert M. Nickerson, Mitul Modi, Sanka Ganesan +4 more | 2022-08-30 |
| 11393762 | Formation of tall metal pillars using multiple photoresist layers | Liwei Cheng, Siddharth K. Alur, Sheng Li | 2022-07-19 |
| 11387175 | Interposer package-on-package (PoP) with solder array thermal contacts | Debendra Mallik, Sanka Ganesan, Pilin Liu, Shawna M. Liff, Sandeep Gaan +2 more | 2022-07-12 |
| 11355849 | Antenna package using ball attach array to connect antenna and base substrates | Jimin Yao, Shawna M. Liff, William J. Lambert, Zhichao Zhang, Robert L. Sankman | 2022-06-07 |
| 11276634 | High density package substrate formed with dielectric bi-layer | Srinivas V. Pietambaram, Rahul N. Manepalli, David Unruh, Frank Truong, Kyu Oh Lee +1 more | 2022-03-15 |
| 11222877 | Thermally coupled package-on-package semiconductor packages | Omkar G. Karhade, Robert L. Sankman, Nitin A. Deshpande, Mitul Modi, Thomas J. De Bonis +6 more | 2022-01-11 |