Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508636 | Multi-layer solution based deposition of dielectrics for advanced substrate architectures | Andrew J. Brown, Ji-Yong Park, Cheng Xu, Amruthavalli Pallavi Alur | 2022-11-22 |
| 11393762 | Formation of tall metal pillars using multiple photoresist layers | Sri Chaitra Jyotsna Chavali, Liwei Cheng, Sheng Li | 2022-07-19 |