Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430740 | Microelectronic device with embedded die substrate on interposer | Robert Alan May, Islam A. Salama, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Robert L. Sankman +1 more | 2022-08-30 |
| 11393762 | Formation of tall metal pillars using multiple photoresist layers | Sri Chaitra Jyotsna Chavali, Liwei Cheng, Siddharth K. Alur | 2022-07-19 |
| 11335632 | Magnetic inductor structures for package devices | Prithwish Chatterjee, Junnan Zhao, Sai Vadlamani, Ying Wang, Rahul Jain +3 more | 2022-05-17 |
| 11251113 | Methods of embedding magnetic structures in substrates | Sai Vadlamani, Prithwish Chatterjee, Robert Alan May, Rahul Jain, Lauren A. Link +2 more | 2022-02-15 |