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Methods to selectively embed magnetic materials in substrate and corresponding structures |
Cheng Xu, Kyu Oh Lee, Junnan Zhao, Rahul Jain, Ji-Yong Park +1 more |
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Substrate assembly with encapsulated magnetic feature |
Kyu Oh Lee, Rahul Jain, Cheng Xu, Ji-Yong Park, Junnan Zhao +1 more |
2022-09-13 |
| 11417614 |
Methods to embed magnetic material as first layer on coreless substrates and corresponding structures |
Cheng Xu, Kyu Oh Lee, Junnan Zhao, Rahul Jain, Ji-Yong Park +1 more |
2022-08-16 |
| 11355459 |
Embedding magnetic material, in a cored or coreless semiconductor package |
Kyu Oh Lee, Rahul Jain, Junnan Zhao, Ji-Yong Park, Cheng Xu +1 more |
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| 11335632 |
Magnetic inductor structures for package devices |
Prithwish Chatterjee, Junnan Zhao, Ying Wang, Rahul Jain, Andrew J. Brown +3 more |
2022-05-17 |
| 11289263 |
Electronic substrates having embedded magnetic material using photo-imagable dielectric layers |
Prithwish Chatterjee, Lauren A. Link, Andrew J. Brown |
2022-03-29 |
| 11251113 |
Methods of embedding magnetic structures in substrates |
Prithwish Chatterjee, Robert Alan May, Rahul Jain, Lauren A. Link, Andrew J. Brown +2 more |
2022-02-15 |
| 11244912 |
Semiconductor package having a coaxial first layer interconnect |
Aleksandar Aleksov, Rahul Jain, Kyu Oh Lee, Kristof Darmawikarta, Robert Alan May +2 more |
2022-02-08 |