| 11521914 |
Microelectronic assemblies having a cooling channel |
Zhimin Wan, Cheng Xu, Yikang Deng, Junnan Zhao, Ying Wang +3 more |
2022-12-06 |
| 11502017 |
Effective heat conduction from hotspot to heat spreader through package substrate |
Cheng Xu, Zhimin Wan, Lingtao Liu, Yikang Deng, Junnan Zhao +1 more |
2022-11-15 |
| 11482471 |
Thermal management solutions for integrated circuit packages |
Cheng Xu, Junnan Zhao, Zhimin Wan, Ying Wang, Yikang Deng +3 more |
2022-10-25 |
| 11450471 |
Methods to selectively embed magnetic materials in substrate and corresponding structures |
Cheng Xu, Junnan Zhao, Rahul Jain, Ji-Yong Park, Sai Vadlamani +1 more |
2022-09-20 |
| 11443892 |
Substrate assembly with encapsulated magnetic feature |
Rahul Jain, Sai Vadlamani, Cheng Xu, Ji-Yong Park, Junnan Zhao +1 more |
2022-09-13 |
| 11432405 |
Methods for attaching large components in a package substrate for advanced power delivery |
Rahul Jain, Prithwish Chatterjee |
2022-08-30 |
| 11417614 |
Methods to embed magnetic material as first layer on coreless substrates and corresponding structures |
Cheng Xu, Junnan Zhao, Rahul Jain, Ji-Yong Park, Sai Vadlamani +1 more |
2022-08-16 |
| 11410921 |
Methods to incorporate thin film capacitor sheets (TFC-S) in the build-up films |
Rahul Jain |
2022-08-09 |
| 11393745 |
Semiconductor packages with embedded interconnects |
Dilan Seneviratne, Ravindranadh Eluri |
2022-07-19 |
| 11387224 |
Phase change material in substrate cavity |
Cheng Xu, Zhimin Wan, Yikang Deng, Junnan Zhao, Chong Zhang +2 more |
2022-07-12 |
| 11380609 |
Microelectronic assemblies having conductive structures with different thicknesses on a core substrate |
Cheng Xu, Jiwei Sun, Ji-Yong Park, Yikang Deng, Zhichao Zhang +2 more |
2022-07-05 |
| 11355459 |
Embedding magnetic material, in a cored or coreless semiconductor package |
Sai Vadlamani, Rahul Jain, Junnan Zhao, Ji-Yong Park, Cheng Xu +1 more |
2022-06-07 |
| 11322290 |
Techniques for an inductor at a first level interface |
Cheng Xu, Yikang Deng, Ji-Yong Park, Srinivas V. Pietambaram, Ying Wang +3 more |
2022-05-03 |
| 11276634 |
High density package substrate formed with dielectric bi-layer |
Srinivas V. Pietambaram, Rahul N. Manepalli, David Unruh, Frank Truong, Junnan Zhao +1 more |
2022-03-15 |
| 11251113 |
Methods of embedding magnetic structures in substrates |
Sai Vadlamani, Prithwish Chatterjee, Robert Alan May, Rahul Jain, Lauren A. Link +2 more |
2022-02-15 |
| 11244912 |
Semiconductor package having a coaxial first layer interconnect |
Sai Vadlamani, Aleksandar Aleksov, Rahul Jain, Kristof Darmawikarta, Robert Alan May +2 more |
2022-02-08 |
| 11217534 |
Galvanic corrosion protection for semiconductor packages |
Cheng Xu, Junnan Zhao, Ji-Yong Park |
2022-01-04 |