Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11444042 | Magnetic structures in integrated circuit packages | Andrew J. Brown, Ying Wang, Chong Zhang, Yikang Deng | 2022-09-13 |
| 11335632 | Magnetic inductor structures for package devices | Prithwish Chatterjee, Junnan Zhao, Sai Vadlamani, Ying Wang, Rahul Jain +3 more | 2022-05-17 |
| 11289263 | Electronic substrates having embedded magnetic material using photo-imagable dielectric layers | Sai Vadlamani, Prithwish Chatterjee, Andrew J. Brown | 2022-03-29 |
| 11251113 | Methods of embedding magnetic structures in substrates | Sai Vadlamani, Prithwish Chatterjee, Robert Alan May, Rahul Jain, Andrew J. Brown +2 more | 2022-02-15 |