| 11527484 |
Dielectric filler material in conductive material that functions as fiducial for an electronic device |
Jesse C. Jones, Gang Duan, Jason M. Gamba, Yosuke Kanaoka, Vishal Shajan |
2022-12-13 |
| 11508676 |
Density-graded adhesion layer for conductors |
Kemal Aygun, Srinivas V. Pietambaram, Cemil Geyik |
2022-11-22 |
| 11501967 |
Selective metal deposition by patterning direct electroless metal plating |
Suddhasattwa Nad, Roy Dittler, Darko Grujicic, Marcel Wall |
2022-11-15 |
| 11445616 |
Interfacial layer for high resolution lithography (HRL) and high speed input/output (IO or I/O) architectures |
Suddhasattwa Nad, Marcel Wall |
2022-09-13 |
| 11380472 |
High-permeability magnetic-dielectric film-based inductors |
Srinivas V. Pietambaram, Kristof Darmawikarta |
2022-07-05 |
| 11355438 |
Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications |
Srinivas V. Pietambaram, Gang Duan |
2022-06-07 |
| 11291122 |
Apparatus with a substrate provided with plasma treatment |
Darko Grujicic, Rengarajan Shanmugam, Sandeep Gaan, Adrian BAYRAKTAROGLU, Roy Dittler +4 more |
2022-03-29 |
| 11276634 |
High density package substrate formed with dielectric bi-layer |
Srinivas V. Pietambaram, David Unruh, Frank Truong, Kyu Oh Lee, Junnan Zhao +1 more |
2022-03-15 |
| 11257748 |
Semiconductor package having polymeric interlayer disposed between conductive elements and dielectric layer |
Suddhasattwa Nad |
2022-02-22 |