Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11443885 | Thin film barrier seed metallization in magnetic-plugged through hole inductor | Kristof Darmawikarta, Srinivas V. Pietambaram, Sri Ranga Sai Boyapati, Prithwish Chatterjee, Sameer Paital +2 more | 2022-09-13 |
| 11387175 | Interposer package-on-package (PoP) with solder array thermal contacts | Debendra Mallik, Sanka Ganesan, Pilin Liu, Shawna M. Liff, Sri Chaitra Jyotsna Chavali +2 more | 2022-07-12 |
| 11291122 | Apparatus with a substrate provided with plasma treatment | Darko Grujicic, Rengarajan Shanmugam, Adrian BAYRAKTAROGLU, Roy Dittler, Ke-Tien Liu +4 more | 2022-03-29 |