Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11443885 | Thin film barrier seed metallization in magnetic-plugged through hole inductor | Kristof Darmawikarta, Srinivas V. Pietambaram, Sandeep Gaan, Sri Ranga Sai Boyapati, Prithwish Chatterjee +2 more | 2022-09-13 |
| 11348718 | Substrate embedded magnetic core inductors and method of making | Srinivas V. Pietambaram, Kristof Darmawikarta, Gang Duan, Yonggang Li | 2022-05-31 |
| 11322444 | Lithographic cavity formation to enable EMIB bump pitch scaling | Kristof Darmawikarta, Hiroki Tanaka, Robert Alan May, Bai Nie, Jesse C. Jones +1 more | 2022-05-03 |
| 11227849 | Electroless-catalyst doped-mold materials for integrated-circuit die packaging architectures | Brandon C. Marin, Srinivas V. Pietambaram, Kristof Darmawikarta, Gang Duan | 2022-01-18 |