Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462432 | Dual side de-bonding in component carriers using photoablation | Frank Truong, Praneeth Akkinepally, Chelsea M. Groves, Whitney Bryks, Jason M. Gamba | 2022-10-04 |
| 11296186 | Package-integrated vertical capacitors and methods of assembling same | Praneeth Akkinepally, Whitney Bryks, Dilan Seneviratne, Frank Truong | 2022-04-05 |
| 11227849 | Electroless-catalyst doped-mold materials for integrated-circuit die packaging architectures | Srinivas V. Pietambaram, Kristof Darmawikarta, Gang Duan, Sameer Paital | 2022-01-18 |