Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11302643 | Microelectronic component having molded regions with through-mold vias | Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Jason M. Gamba, Manish Dubey +1 more | 2022-04-12 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11302643 | Microelectronic component having molded regions with through-mold vias | Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Jason M. Gamba, Manish Dubey +1 more | 2022-04-12 |