Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532563 | Package integration using fanout cavity substrate | Karthik Shanmugam, Jun Zhai | 2022-12-20 |
| 11430724 | Ultra-thin, hyper-density semiconductor packages | Debendra Mallik, Robert L. Sankman, Robert M. Nickerson, Mitul Modi, Sanka Ganesan +4 more | 2022-08-30 |
| 11398692 | Socket with integrated flex connector | Mahesh S. Hardikar, David A. Secker, Ravindranath Kollipara, Robert R. Atkinson | 2022-07-26 |
| 11296050 | Chip with magnetic interconnect alignment | — | 2022-04-05 |
| 11270942 | Pitch translation architecture for semiconductor package including embedded interconnect bridge | Andrew Collins, Bharat P. Penmecha, Ram Viswanath | 2022-03-08 |