Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532563 | Package integration using fanout cavity substrate | Jun Zhai, Rajasekaran Swaminathan | 2022-12-20 |
| 11515261 | Multiple component integration in fanout package with different back side metallization and thicknesses | Jun Zhai | 2022-11-29 |
| 11395408 | Wafer-level passive array packaging | Scott D. Morrison, Raymundo M. Camenforte, Rakshit Agrawal, Flynn Carson, Kiranjit Dhaliwal | 2022-07-19 |