Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532563 | Package integration using fanout cavity substrate | Karthik Shanmugam, Rajasekaran Swaminathan | 2022-12-20 |
| 11515261 | Multiple component integration in fanout package with different back side metallization and thicknesses | Karthik Shanmugam | 2022-11-29 |
| 11476203 | Die-to-die routing through a seal ring | Sanjay Dabral | 2022-10-18 |
| 11404337 | Scalable extreme large size substrate integration | Kunzhong Hu, Chonghua Zhong, Jiongxin Lu | 2022-08-02 |
| 11398456 | Wafer level integration of passive devices | — | 2022-07-26 |
| 11317573 | Modular vertical water storage greening system | — | 2022-05-03 |
| 11309246 | High density 3D interconnect configuration | Sanjay Dabral, Zhitao Cao, Kunzhong Hu | 2022-04-19 |
| 11217563 | Fully interconnected heterogeneous multi-layer reconstructed silicon device | — | 2022-01-04 |