Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476203 | Die-to-die routing through a seal ring | Jun Zhai | 2022-10-18 |
| 11309246 | High density 3D interconnect configuration | Zhitao Cao, Kunzhong Hu, Jun Zhai | 2022-04-19 |
| 11309895 | Systems and methods for implementing a scalable system | Bahattin Kilic, Jie Zhao, Kunzhong Hu, Suk-Kyu Ryu | 2022-04-19 |