Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404337 | Scalable extreme large size substrate integration | Chonghua Zhong, Jiongxin Lu, Jun Zhai | 2022-08-02 |
| 11309246 | High density 3D interconnect configuration | Sanjay Dabral, Zhitao Cao, Jun Zhai | 2022-04-19 |
| 11309895 | Systems and methods for implementing a scalable system | Sanjay Dabral, Bahattin Kilic, Jie Zhao, Suk-Kyu Ryu | 2022-04-19 |